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3M™ 5413 polyimide adhesive tape is used as a masking device for protecting gold-plated contacts on printed circuit boards in wave soldering processes, as high temperature protection, or as an anti-stick surface for the manufacture of Materials polymerized at high temperature.
3M™ 5413 polyimide adhesive tape is used as a masking device for protecting gold-plated contacts on printed circuit boards in wave soldering processes, as high temperature protection, or as an anti-stick surface for the manufacture of Materials polymerized at high temperature.
3M™ 5413 polyimide adhesive tape is used as a masking device for protecting gold-plated contacts on printed circuit boards in wave soldering processes, as high temperature protection, or as an anti-stick surface for the manufacture of Materials polymerized at high temperature.